Product Overview
Key Applications Computer Vision Natural Language Processing Recommendation Purpose Built for AI/Deep Learning Training Key Features Dual Intel庐 Xeon庐 3rd Gen Scalable Processors (Ice Lake) TDP up to 270W Intel庐 C621A Chipset 32x DIMM slots, up to 8TB Registered ECC DDR4 3200MHz SDRAM 2x PCIe 4.0 x16 FHFL slot and 2x PCIe 4.0 x8 FHFL slot 6x 400GbE QSFP-DD for scale-out and 1x 1GbE BaseT (dedicated IPMI port) 4x 2.5驴NVMe Hot-Swap Drive Bays Up to 8x 2.5" SATA Hot-Swap Drive Bays Up to 16x 2.5" SATA Hot-Swap Drive Bays (Additional SAOC is required)
