Super 2114S-WN24RT,1x AMD 7002,Video,2x 10GB/BCM57416,24x HS 2.5" U.2 NVMe,IPMI,D4(4TB),2U RM,R1200W
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Key Features 驴 Virtualization 驴 Hyperconverged Storage 驴 Cloud Computing 驴 All Flash Storage 1. Single AMD EPYC驴 7002-Series Processor 2. Up to 4TB Registered ECC DDR4   2666MHz SDRAM in 16 DIMMs 3. Expansion slots:   1 PCI-E 3.0 x16 (FH/HL) slot   M.2 Interface: PCI-E 3.0 x4    (NVMe based)   M.2 Form Factor: 2280, 22110   M.2 Key: Onboard M-key   Number of M.2: Dual 4. Integrated IPMI 2.0 + KVM with   dedicated LAN 5. 2x 10GBase-T LAN ports   via Broadcom BCM57416 6. 24 hot-swap 2.5" U.2 NVMe drive bays 7. 1200W Redundant Power Supplies   Titanium Level (96%)   (Full redundancy based on configuration   and application load). SMC Note: Due to the complexity of integration, this product is sold as a completely assembled system only (with 1 CPU, minimum 4 DIMMs, at least 1 NVMe). Recommended configuration for best performance is at least 1 DIMM per channel (8 DIMM Total). Please contact your sales rep for special requirements. Complete System Only: To maintain quality and integrity, this product is sold only as a completely-assembled system (with 1 CPU, minimum 8 DIMMs, 1 NVMe). Recommended configuration for best performance is at least 24 or 32 Cores per CPU.
Super 2115GT-HNTF,4xNodes,1xAMD 9004,Video,AIOM/OCP3.0,4xHS 2.5" NVMe Bays,IPMI,D4(3TB),2U RM,R2200W
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Key Applications HPC Cloud Gaming MEC (Multi-Access Edge Computing) Multi-Purpose CDN High-availability Cache Cluster Telco Edge Cloud EDA (Electric Design Automation) Mission Critical Web Applications Key Features Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following: Single-Socket, AMD EPYC驴 9004 Series Processors up to 360W TDP 12 DIMM Slots , up to 3TB聽DDR5 memory Flexible bays for either Storage or AIOM / OCP 3.0 slots Integrated GrandTwin I/O Module with BMC, 2x USB, VGA and 2x 10GbE or 2x 25GbE Up to 4 Hot-swap 2.5" NVMe/SATA drives
Super 2115GT-HNTR,4xNodes,1xAMD 9004,Video,2xAIOM/OCP3,6xHS 2.5" NVMe Bays,IPMI,D4(3TB),2U RM,R2200W
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Key Applications HPC Cloud Gaming MEC (Multi-Access Edge Computing) Multi-Purpose CDN High-availability Cache Cluster Telco Edge Cloud EDA (Electric Design Automation) Mission Critical Web Applications Key Features Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following: Single-Socket, AMD EPYC驴 9004 Series Processors up to 290W TDP 12 DIMM Slots , up to 3TB聽DDR5 memory 2 AIOM / OCP 3.0 slots up to 6 Hot-swap 2.5"NVMe/SATA drives
Super 211E-FRDN13P,1xLGA-4677,2xPCIe5.0,Video,12x25Gb/SPF28,2x2.5" SATA+Raid,IPM,D5(2TB),2U/R600W,DC
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Key Applications Network Function Virtualization Cloud Computing 5G CU/DU Edge Server Flex RAN, Open RAN vBBU Key Features Design with compliance to NEBS-Level 3 DPLL/OCXO design, Up to 8 hours hold-over IEEE1588 v2 & Synchronous Ethernet support Single Socket E (LGA-4677) 5th/4th Gen Intel庐 Xeon庐 Scalable processors 8 DIMM slots, Max Memory (1DPC): Up to 2TB 5600MT/s ECC DDR5 RDIMM/LRDIMM 2x PCIe 5.0 x8 FHHL expansion slots for Accelerator Add-On-Cards Onboard 12x 25GbE SFP28 ports 2x 2.5" drive bays for SSD drives
Super 211E-FRDN2T,1xLGA-4677,4xPCIe5.0,Video,2x10GB LAN,2x Int 2.5" NVMe,IPM,D5(2TB),2U/R600W,DC-48V
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Key Applications 5G Core and Edge AI Inference and Machine Learning Network Function Virtualization Cloud Computing Key Features Design with compliance to NEBS-Level 3 Single Socket E (LGA-4677) 4th Gen Intel庐 Xeon庐 Scalable processors 8 DIMM slots; Up to 2TB 3DS ECC DDR5-4800: RDIMM/LRDIMM Up to 3 PCIe 5.0 x16 FHHL, 1 PCIe 5.0 X16 HHHL & 1 PCIe 5.0 x8 FHHL expansion slots for Accelerator Add-On-Cards Onboard 2x 10GbE ports 2x 2.5" drive bays for NVMe drives 2x 600W DC -48V Power Supplies Ultra short depth, 2U Front I/O Edge Server
Super 211E-FRN13P,1xLGA-4677,2xPCIe5.0,Video,12x25Gb/SPF28,2x2.5" SATA+Raid,IPM,D5(2TB),2U/R800W
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Key Applications Network Function Virtualization Cloud Computing 5G CU/DU Edge Server Flex RAN, Open RAN vBBU Key Features Design with compliance to NEBS-Level 3 DPLL/OCXO design, Up to 8 hours hold-over IEEE1588 v2 & Synchronous Ethernet support Single Socket E (LGA-4677) 5th/4th Gen Intel庐 Xeon庐 Scalable processors 8 DIMM slots, Max Memory (1DPC): Up to 2TB 5600MT/s ECC DDR5 RDIMM/LRDIMM 2x PCIe 5.0 x8 FHHL expansion slots for Accelerator Add-On-Cards Onboard 12x 25GbE SFP28 ports 2x 2.5" drive bays for SSD drives
Super 211E-FRN2T,1xLGA-4677,4x PCIe5.0,Video,2x10GB LAN,2x Int 2.5" NVMe,M.2,IPM,D5(2TB),2U/R600W,AC
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Key Applications 5G Core and Edge AI Inference and Machine Learning Network Function Virtualization Cloud Computing Key Features Design with compliance to NEBS-Level 3 Single Socket E (LGA-4677) 4th Gen Intel庐 Xeon庐 Scalable processors 8 DIMM slots; Up to 2TB 3DS ECC DDR5-4800: RDIMM/LRDIMM Up to 3 PCIe 5.0 x16 FHHL, 1 PCIe 5.0 X16 HHHL & 1 PCIe 5.0 x8 FHHL expansion slots for Accelerator Add-On-Cards Onboard 2x 10GbE ports 2x 2.5" drive bays for NVMe drives Redundant 800W AC Power Supplies Ultra short depth, 2U Front I/O Edge Server
Super 211GT-HNC8F,4xNode,1xLGA-4677,GrandTwin F I/O,AIOM,4xHS 2.5" SAS3(3808),IPMI,D5(4TB),2U/R2200W
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Key Applications HPC Cloud Gaming MEC (Multi-Access Edge Computing) Multi-Purpose CDN High-availability Cache Cluster Telco Edge Cloud EDA (Electric Design Automation) Mission Critical Web Applications Key Features Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following: Single-Socket, 4th Gen Intel庐 Xeon庐 Scalable processors up to 350W TDP Intel庐 C741 16 DIMM Slots up to 4TB (with Intel庐 Optane驴 Persistent Memory support) Optional AIOM module or PCIe 5.0 x16 Integrated GrandTwin I/O Module with BMC, 2x USB, VGA and 2x 10GbE or 2x 25GbE
Super 211GT-HNC8R,4xNode,1xLGA-4677,GrandTwin R I/O,AIOM,6xHS 2.5" SAS3(3808),IPMI,D5(4TB),2U/R2200W
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Key Applications HPC Cloud Gaming MEC (Multi-Access Edge Computing) Multi-Purpose CDN High-availability Cache Cluster Telco Edge Cloud EDA (Electric Design Automation) Mission Critical Web Applications Key Features Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following: Single-Socket, 4th Gen Intel庐 Xeon庐 Scalable processors up to 300W TDP Intel庐 C741 16 DIMM Slots up to 4TB (with Intel庐 Optane驴 Persistent Memory support) 2 AIOM 6x NVMe/SAS/SATA drive bays
Super 211GT-HNTF,4xNode,1xLGA-4677,GrandTwin F I/O,AIOM,4x HS 2.5" NVMe/SATA3,IPMI,D5(4TB),2U/R2200W
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Key Applications HPC Cloud Gaming MEC (Multi-Access Edge Computing) Multi-Purpose CDN High-availability Cache Cluster Telco Edge Cloud EDA (Electric Design Automation) Mission Critical Web Applications Key Features Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following: Single-Socket, 4th Gen Intel庐 Xeon庐 Scalable processors up to 350W TDP Intel庐 C741 16 DIMM Slots up to 4TB (with Intel庐 Optane驴 Persistent Memory support) Optional AIOM module or PCIe 5.0 x16 Integrated GrandTwin I/O Module with BMC, 2x USB, VGA and 2x 10GbE or 2x 25GbE
Super 211GT-HNTR,4xNode,1xLGA-4677,GrandTwin R I/O,AIOM,6x HS 2.5" NVMe/SATA3,IPMI,D5(4TB),2U/R2200W
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Key Applications HPC Cloud Gaming MEC (Multi-Access Edge Computing) Multi-Purpose CDN High-availability Cache Cluster Telco Edge Cloud EDA (Electric Design Automation) Mission Critical Web Applications Key Features Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following: Single-Socket, 4th Gen Intel庐 Xeon庐 Scalable processors up to 300W TDP Intel庐 C741 16 DIMM Slots up to 4TB (with Intel庐 Optane驴 Persistent Memory support) 2 AIOM Up to 6 Hot-swap 2.5" NVMe/SATA drives
Super 211SE-31A,3x Nodes, 4Gen 1xLGA-4189,Video,1xGB,2xNVMe M.2,IPMI,KVM+COM,D5(2TB),2U/F R2KW, *AC
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Key Applications Multi-Access Edge Computing Flex-RAN, Open-RAN vBBU Telecom DRAN, CRAN, and Edge Core Application Enterprise Edge Computing Key Features Three hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following: Single Socket E (LGA-4189) 4th Gen Intel庐 Xeon庐 Scalable processor (per node) 8 DIMMs; Up to 2TB 3DS ECC DDR5-4800: RDIMM/LRDIMM (per node) 2 PCIe Gen5 x16 FHHL slot and 1 PCIe Gen5 x16 HHHL slot (per node) 2 NVMe M.2 2280/22110 (per node) 4 counter-rotated fan speed control (per node); 1 Air Shroud (per node) Front-access 2000W AC Redundant Power Supplies (per system)
Super 211SE-31AS,3xNodes,4Gen 1xLGA-4189,Video,1xGB/SFP,2xNVMe M.2,IPMI,KVM+COM,D5(2TB),2U R2KW, *AC
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Key Applications Multi-Access Edge Computing Flex-RAN, Open-RAN vBBU Telecom DRAN, CRAN, and Edge Core Application Enterprise Edge Computing Key Features Three hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following: Single Socket E (LGA-4189) 4th Gen Intel庐 Xeon庐 Scalable processor (per node) 8 DIMMs; Up to 2TB 3DS ECC DDR5-4800: RDIMM/LRDIMM (per node) 2 PCIe Gen5 x16 FHHL slot and 1 PCIe Gen5 x16 HHHL slot (per node) 2 NVMe M.2 2280/22110 (per node) 4 counter-rotated fan speed control (per node); 1 Air Shroud (per node) Front-access 2000W AC Redundant Power Supplies (per system)
Super 211SE-31D,3x Nodes,4Gen 1xLGA-4189,Video,1xGB,2xNVMe M.2,IPMI,KVM+COM,D5(2TB),2U R2KW, *DC
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Key Applications Multi-Access Edge Computing Flex-RAN, Open-RAN vBBU Telecom DRAN, CRAN, and Edge Core Application Enterprise Edge Computing Key Features Three hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following: Single Socket E (LGA-4189) 4th Gen Intel庐 Xeon庐 Scalable processor (per node) 8 DIMMs; Up to 2TB 3DS ECC DDR5-4800: RDIMM/LRDIMM (per node) 2 PCIe Gen5 x16 FHHL slot and 1 PCIe Gen5 x16 HHHL slot (per node) 2 NVMe M.2 2280/22110 (per node) 4 counter-rotated fan speed control (per node); 1 Air Shroud (per node) Front-access 1+1 Redundant 2000W DC Power Supplies (per system)
Super 211SE-31DS,3xNodes,4Gen 1xLGA-4189,Video,1xGB/SFP,2xNVMe M.2,IPMI,KVM+COM,D5(2TB),2U R2KW, *DC
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Key Applications Multi-Access Edge Computing Flex-RAN, Open-RAN vBBU Telecom DRAN, CRAN, and Edge Core Application Enterprise Edge Computing Key Features Three hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following: Single Socket E (LGA-4677) 4th Gen Intel庐 Xeon庐 Scalable processor (per node) 8 DIMMs; Up to 2TB 3DS ECC DDR5-4800: RDIMM/LRDIMM (per node) 2 PCIe Gen5 x16 FHHL slot and 1 PCIe Gen5 x16 HHHL slot (per node) 2 NVMe M.2 2280/22110 (per node) 4 counter-rotated fan speed control (per node); 1 Air Shroud (per node) Front-access 1+1 Redundant 2000W DC Power Supplies (per system)
Super 211TP-HPTR,4xNodes,1xLGA-4677,Video,2x10Gb/SFP+/X710,6xHS 2.5" SATA,2xM.2,IPMI,D4(2TB),2U/R2KW
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Key Applications Multi-Access Edge Computing Flex-RAN, Open-RAN vBBU Telecom DRAN, CRAN, and Edge Core Application Enterprise Edge Computing Key Features Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following: Single Socket E (LGA-4677) 5th Gen Intel庐 Xeon庐/4th Gen Intel庐 Xeon Scalable processors (per node) Intel庐 C741 Chipset 8 DIMMs; Up to 2TB ECC DDR5-5600MT/s: R-DIMM / R-DIMM 3DS (per node) 2 PCIe Gen5 x16 HHHL slot (per node) 2 NVMe M.2 2280 / 25110 (per node)
Super 211TP-HPTRD,4xNode,1xLGA-4677,Video,2x10G/SFP+/X710,6xHS 2.5" SATA,M.2,IPMI,D4(2TB),2U/R2KW,DC
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Key Applications Multi-Access Edge Computing Flex-RAN, Open-RAN vBBU Telecom DRAN, CRAN, and Edge Core Application Enterprise Edge Computing Key Features Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following: Single Socket E (LGA-4677) 5th Gen Intel庐 Xeon庐/4th Gen Intel庐 Xeon Scalable processors (per node) Intel庐 C741 Chipset 8 DIMMs; Up to 2TB ECC DDR5-5600MT/s: R-DIMM / R-DIMM 3DS (per node) 2 PCIe Gen5 x16 HHHL slot (per node) 2 NVMe M.2 2280 / 25110 (per node)
Super 2122TC-DL6RF4,2xNodes,2xAMD 4000,Video,4xGB,12xHS 2.5" SAS2(2008/IT),IPMI,D3/192G,2U RM,R1280W
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Key Features (per node) Two hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following: 1. Dual AMD Opteron驴 4000 series processors (Socket C32) 8/6/4-Core ready; HT3.0 Link support 2. Up to 192GB DDR3 1600MHz ECC Registered DIMM; 12x DIMM sockets 3. 2 (x8) PCI-E 2.0 (in x16, low-profile) 4. Intel庐 I350 (Powerville) Quad Gigabit Ethernet LAN controller 5. 12x 2.5" Hot-swap SAS2/SATA/SSD HDDs (24 total) 6. LSI 6Gbps SAS 2008 IT Mode 7. 1280W High-Efficiency Platinum Level Redundant Power Supplies (94% Efficiency) 8. IPMI 2.0 with dedicated LAN
Super 2122TC-H6RF4,4xNodes,2xAMD 4000,Video,4xGB,12xHS 2.5" SAS2(2108/HWR),IPMI,D3/192G,2U RM,R1280W
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Key Features (per node) Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following: 1. Dual AMD Opteron驴 4000 series processors (Socket C32) 8/6/4-Core ready; HT3.0 Link support 2. Up to 192GB DDR3 1600MHz ECC Registered DIMM; 12x DIMM sockets 3. 1x Low-profile PCI-E 2.0 in x16 slot (For add-on card up to 6.59"in length) 4. Quad-port GbE LAN Controller, 4x USB 2.0 ports, 1x dedicated LAN for system management (IPMI 2.0) 5. LSI 6Gbps SAS 2108 w/ Hardware RAID support 6. 1620W High-Efficiency Platinum Level Redundant Power Supplies (94% Efficiency)
Super 2122TG-H6RF, 4x Nodes, 2x 6300/16C, Video,2x GB Lan,6x HS 2.5" SAS2,IPMI,D3/256G,2U,R1620W/80+
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Key Features (per node) Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following: 1. Dual AMD Opteron驴 6000 series (6300 ready) processors (Socket G34) 16/12/8/4-Core ready; HT3.0 Link support 2. Up to 256GB DDR3 1866MHz ECC Registered DIMMs; 8x DIMM sockets 3. 1x Low-profile PCI-E 2.0 in x16 slot (For add-on card up to 6.59"in length) 4. Dual-port GbE LAN Controller, 4x USB 2.0 ports, 1x dedicated LAN for system management (IPMI 2.0) 5. LSI 6Gbps SAS 2108 w/ Hardware RAID support 6. 1620W High-Efficiency Platium Level Redundant Power Supplies (94% Efficiency)