Super 211E-FRN2T,1xLGA-4677,4x PCIe5.0,Video,2x10GB LAN,2x Int 2.5" NVMe,M.2,IPM,D5(2TB),2U/R600W,AC
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Key Applications 5G Core and Edge AI Inference and Machine Learning Network Function Virtualization Cloud Computing Key Features Design with compliance to NEBS-Level 3 Single Socket E (LGA-4677) 4th Gen Intel庐 Xeon庐 Scalable processors 8 DIMM slots; Up to 2TB 3DS ECC DDR5-4800: RDIMM/LRDIMM Up to 3 PCIe 5.0 x16 FHHL, 1 PCIe 5.0 X16 HHHL & 1 PCIe 5.0 x8 FHHL expansion slots for Accelerator Add-On-Cards Onboard 2x 10GbE ports 2x 2.5" drive bays for NVMe drives Redundant 800W AC Power Supplies Ultra short depth, 2U Front I/O Edge Server
Super 211GT-HNC8F,4xNode,1xLGA-4677,GrandTwin F I/O,AIOM,4xHS 2.5" SAS3(3808),IPMI,D5(4TB),2U/R2200W
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Key Applications HPC Cloud Gaming MEC (Multi-Access Edge Computing) Multi-Purpose CDN High-availability Cache Cluster Telco Edge Cloud EDA (Electric Design Automation) Mission Critical Web Applications Key Features Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following: Single-Socket, 4th Gen Intel庐 Xeon庐 Scalable processors up to 350W TDP Intel庐 C741 16 DIMM Slots up to 4TB (with Intel庐 Optane驴 Persistent Memory support) Optional AIOM module or PCIe 5.0 x16 Integrated GrandTwin I/O Module with BMC, 2x USB, VGA and 2x 10GbE or 2x 25GbE
Super 211GT-HNC8R,4xNode,1xLGA-4677,GrandTwin R I/O,AIOM,6xHS 2.5" SAS3(3808),IPMI,D5(4TB),2U/R2200W
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Key Applications HPC Cloud Gaming MEC (Multi-Access Edge Computing) Multi-Purpose CDN High-availability Cache Cluster Telco Edge Cloud EDA (Electric Design Automation) Mission Critical Web Applications Key Features Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following: Single-Socket, 4th Gen Intel庐 Xeon庐 Scalable processors up to 300W TDP Intel庐 C741 16 DIMM Slots up to 4TB (with Intel庐 Optane驴 Persistent Memory support) 2 AIOM 6x NVMe/SAS/SATA drive bays
Super 211GT-HNTF,4xNode,1xLGA-4677,GrandTwin F I/O,AIOM,4x HS 2.5" NVMe/SATA3,IPMI,D5(4TB),2U/R2200W
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Key Applications HPC Cloud Gaming MEC (Multi-Access Edge Computing) Multi-Purpose CDN High-availability Cache Cluster Telco Edge Cloud EDA (Electric Design Automation) Mission Critical Web Applications Key Features Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following: Single-Socket, 4th Gen Intel庐 Xeon庐 Scalable processors up to 350W TDP Intel庐 C741 16 DIMM Slots up to 4TB (with Intel庐 Optane驴 Persistent Memory support) Optional AIOM module or PCIe 5.0 x16 Integrated GrandTwin I/O Module with BMC, 2x USB, VGA and 2x 10GbE or 2x 25GbE
Super 211GT-HNTR,4xNode,1xLGA-4677,GrandTwin R I/O,AIOM,6x HS 2.5" NVMe/SATA3,IPMI,D5(4TB),2U/R2200W
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Key Applications HPC Cloud Gaming MEC (Multi-Access Edge Computing) Multi-Purpose CDN High-availability Cache Cluster Telco Edge Cloud EDA (Electric Design Automation) Mission Critical Web Applications Key Features Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following: Single-Socket, 4th Gen Intel庐 Xeon庐 Scalable processors up to 300W TDP Intel庐 C741 16 DIMM Slots up to 4TB (with Intel庐 Optane驴 Persistent Memory support) 2 AIOM Up to 6 Hot-swap 2.5" NVMe/SATA drives
Super 211SE-31A,3x Nodes, 4Gen 1xLGA-4189,Video,1xGB,2xNVMe M.2,IPMI,KVM+COM,D5(2TB),2U/F R2KW, *AC
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Key Applications Multi-Access Edge Computing Flex-RAN, Open-RAN vBBU Telecom DRAN, CRAN, and Edge Core Application Enterprise Edge Computing Key Features Three hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following: Single Socket E (LGA-4189) 4th Gen Intel庐 Xeon庐 Scalable processor (per node) 8 DIMMs; Up to 2TB 3DS ECC DDR5-4800: RDIMM/LRDIMM (per node) 2 PCIe Gen5 x16 FHHL slot and 1 PCIe Gen5 x16 HHHL slot (per node) 2 NVMe M.2 2280/22110 (per node) 4 counter-rotated fan speed control (per node); 1 Air Shroud (per node) Front-access 2000W AC Redundant Power Supplies (per system)
Super 211SE-31AS,3xNodes,4Gen 1xLGA-4189,Video,1xGB/SFP,2xNVMe M.2,IPMI,KVM+COM,D5(2TB),2U R2KW, *AC
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Key Applications Multi-Access Edge Computing Flex-RAN, Open-RAN vBBU Telecom DRAN, CRAN, and Edge Core Application Enterprise Edge Computing Key Features Three hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following: Single Socket E (LGA-4189) 4th Gen Intel庐 Xeon庐 Scalable processor (per node) 8 DIMMs; Up to 2TB 3DS ECC DDR5-4800: RDIMM/LRDIMM (per node) 2 PCIe Gen5 x16 FHHL slot and 1 PCIe Gen5 x16 HHHL slot (per node) 2 NVMe M.2 2280/22110 (per node) 4 counter-rotated fan speed control (per node); 1 Air Shroud (per node) Front-access 2000W AC Redundant Power Supplies (per system)
Super 211SE-31D,3x Nodes,4Gen 1xLGA-4189,Video,1xGB,2xNVMe M.2,IPMI,KVM+COM,D5(2TB),2U R2KW, *DC
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Key Applications Multi-Access Edge Computing Flex-RAN, Open-RAN vBBU Telecom DRAN, CRAN, and Edge Core Application Enterprise Edge Computing Key Features Three hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following: Single Socket E (LGA-4189) 4th Gen Intel庐 Xeon庐 Scalable processor (per node) 8 DIMMs; Up to 2TB 3DS ECC DDR5-4800: RDIMM/LRDIMM (per node) 2 PCIe Gen5 x16 FHHL slot and 1 PCIe Gen5 x16 HHHL slot (per node) 2 NVMe M.2 2280/22110 (per node) 4 counter-rotated fan speed control (per node); 1 Air Shroud (per node) Front-access 1+1 Redundant 2000W DC Power Supplies (per system)
Super 211SE-31DS,3xNodes,4Gen 1xLGA-4189,Video,1xGB/SFP,2xNVMe M.2,IPMI,KVM+COM,D5(2TB),2U R2KW, *DC
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Key Applications Multi-Access Edge Computing Flex-RAN, Open-RAN vBBU Telecom DRAN, CRAN, and Edge Core Application Enterprise Edge Computing Key Features Three hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following: Single Socket E (LGA-4677) 4th Gen Intel庐 Xeon庐 Scalable processor (per node) 8 DIMMs; Up to 2TB 3DS ECC DDR5-4800: RDIMM/LRDIMM (per node) 2 PCIe Gen5 x16 FHHL slot and 1 PCIe Gen5 x16 HHHL slot (per node) 2 NVMe M.2 2280/22110 (per node) 4 counter-rotated fan speed control (per node); 1 Air Shroud (per node) Front-access 1+1 Redundant 2000W DC Power Supplies (per system)
Super 211TP-HPTR,4xNodes,1xLGA-4677,Video,2x10Gb/SFP+/X710,6xHS 2.5" SATA,2xM.2,IPMI,D4(2TB),2U/R2KW
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Key Applications Multi-Access Edge Computing Flex-RAN, Open-RAN vBBU Telecom DRAN, CRAN, and Edge Core Application Enterprise Edge Computing Key Features Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following: Single Socket E (LGA-4677) 5th Gen Intel庐 Xeon庐/4th Gen Intel庐 Xeon Scalable processors (per node) Intel庐 C741 Chipset 8 DIMMs; Up to 2TB ECC DDR5-5600MT/s: R-DIMM / R-DIMM 3DS (per node) 2 PCIe Gen5 x16 HHHL slot (per node) 2 NVMe M.2 2280 / 25110 (per node)
Super 211TP-HPTRD,4xNode,1xLGA-4677,Video,2x10G/SFP+/X710,6xHS 2.5" SATA,M.2,IPMI,D4(2TB),2U/R2KW,DC
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Key Applications Multi-Access Edge Computing Flex-RAN, Open-RAN vBBU Telecom DRAN, CRAN, and Edge Core Application Enterprise Edge Computing Key Features Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following: Single Socket E (LGA-4677) 5th Gen Intel庐 Xeon庐/4th Gen Intel庐 Xeon Scalable processors (per node) Intel庐 C741 Chipset 8 DIMMs; Up to 2TB ECC DDR5-5600MT/s: R-DIMM / R-DIMM 3DS (per node) 2 PCIe Gen5 x16 HHHL slot (per node) 2 NVMe M.2 2280 / 25110 (per node)
Super 2122TC-DL6RF4,2xNodes,2xAMD 4000,Video,4xGB,12xHS 2.5" SAS2(2008/IT),IPMI,D3/192G,2U RM,R1280W
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Key Features (per node) Two hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following: 1. Dual AMD Opteron驴 4000 series processors (Socket C32) 8/6/4-Core ready; HT3.0 Link support 2. Up to 192GB DDR3 1600MHz ECC Registered DIMM; 12x DIMM sockets 3. 2 (x8) PCI-E 2.0 (in x16, low-profile) 4. Intel庐 I350 (Powerville) Quad Gigabit Ethernet LAN controller 5. 12x 2.5" Hot-swap SAS2/SATA/SSD HDDs (24 total) 6. LSI 6Gbps SAS 2008 IT Mode 7. 1280W High-Efficiency Platinum Level Redundant Power Supplies (94% Efficiency) 8. IPMI 2.0 with dedicated LAN
Super 2122TC-H6RF4,4xNodes,2xAMD 4000,Video,4xGB,12xHS 2.5" SAS2(2108/HWR),IPMI,D3/192G,2U RM,R1280W
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Key Features (per node) Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following: 1. Dual AMD Opteron驴 4000 series processors (Socket C32) 8/6/4-Core ready; HT3.0 Link support 2. Up to 192GB DDR3 1600MHz ECC Registered DIMM; 12x DIMM sockets 3. 1x Low-profile PCI-E 2.0 in x16 slot (For add-on card up to 6.59"in length) 4. Quad-port GbE LAN Controller, 4x USB 2.0 ports, 1x dedicated LAN for system management (IPMI 2.0) 5. LSI 6Gbps SAS 2108 w/ Hardware RAID support 6. 1620W High-Efficiency Platinum Level Redundant Power Supplies (94% Efficiency)
Super 2122TG-H6RF, 4x Nodes, 2x 6300/16C, Video,2x GB Lan,6x HS 2.5" SAS2,IPMI,D3/256G,2U,R1620W/80+
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Key Features (per node) Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following: 1. Dual AMD Opteron驴 6000 series (6300 ready) processors (Socket G34) 16/12/8/4-Core ready; HT3.0 Link support 2. Up to 256GB DDR3 1866MHz ECC Registered DIMMs; 8x DIMM sockets 3. 1x Low-profile PCI-E 2.0 in x16 slot (For add-on card up to 6.59"in length) 4. Dual-port GbE LAN Controller, 4x USB 2.0 ports, 1x dedicated LAN for system management (IPMI 2.0) 5. LSI 6Gbps SAS 2108 w/ Hardware RAID support 6. 1620W High-Efficiency Platium Level Redundant Power Supplies (94% Efficiency)
Super 2122TG-H6iBQRF, 4x Nodes,2x 6300/16C,Video,2x GB Lan,6x HS 2.5" SAS2,IB,D3/256G,2U,R1620W/80+
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Key Features (per node) Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following: 1. Dual AMD Opteron驴 6000 series (6300 ready) processors (Socket G34) 16/12/8/4-Core ready; HT3.0 Link support 2. Up to 256GB DDR3 1866MHz ECC Registered DIMMs; 8x DIMM sockets 3. 1x Low-profile PCI-E 2.0 in x16 slot (For add-on card up to 6.59"in length) 4. Dual-port GbE LAN Controller, 4x USB 2.0 ports, 1x dedicated LAN for system management (IPMI 2.0) 5. LSI 6Gbps SAS 2108 w/ Hardware RAID support 6. 1620W High-Efficiency Platium Level Redundant Power Supplies (94% Efficiency) 7. Mellanox ConnectX-2 QDR Infiniband 40Gbps Controller w/ QSFP connector 8. IPMI 2.0 with dedicated LAN
Super 2122TG-HTRF, 4x Nodes, 2x 6300/16C, Video,2x GB Lan,6x HS 2.5" Bays,IPMI,D3/512G,2U,R1400W/80+
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Key Features (per node) Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following: 1. Dual AMD Opteron驴 6000 series (6300 ready) processors (Socket G34) 16/12/8/4-Core ready; HT3.0 Link support 2. Up to 512GB DDR3 1600MHz ECC Registered DIMM; 16x DIMM sockets 3. 1x Low-profile PCI-E 2.0 in x16 slot (For add-on card up to 5.9"in length) 4. Dual-port GbE LAN Controller, 4x USB 2.0 ports, 1x dedicated LAN for system management (IPMI 2.0) 5. 6x Hot-swap SATA Drive Bays 6. 1400W High-efficiency Redundant Power Supplies; 80PLUS Gold Certified
Super 2122TG-HiBQRF, 4x Nodes,2x 6300/16C,Video,2xGB & 1xQSFP,6x HS 2.5" SATA3,D3/512GB,2U RM,R1400W
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Key Features (per node) Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following: 1. Dual AMD Opteron驴 6000 Series 1. Dual AMD Opteron驴 6000 series (6300 ready) processors (Socket G34) 16/12/8/4-Core ready; HT3.0 Link support 2. Up to 512GB DDR3 1600MHz ECC Registered DIMM; 16x DIMM sockets 3. 1x Low-profile PCI-E 2.0 in x16 slot (For add-on card up to 5.9"in length) 4. Dual-port GbE LAN Controller, 4x USB 2.0 ports, 1x dedicated LAN for system management (IPMI 2.0) 5. 6x Hot-swap SATA Drive Bays 6. Mellanox ConnectX-2 QDR Infiniband 40Gbps Controller w/ QSFP connector 7. 1400W High-efficiency Redundant Power Supplies; 80PLUS Gold Certified
Super 2124GQ-NART+,2xAMD7002/3,Up to 4GPUs,2x10GB,4xHS 2.5"(SAS3/SATA/NVMe),IPMI,D4(8TB),2URM,R3000W
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Key Applications - AI Compute / Model Training / Deep Learning - High-performance Computing (HPC) Key Features 1. High Density 2U System with NVIDIA庐 HGX驴 A100 4-GPU 2. Supports 4 A100 40GB SXM4 GPUs 3. Direct connect PCI-E Gen4 Platform with NVIDIA庐 NVLink驴 4. On board BMC supports integrated IPMI 2.0 + KVM with dedicated 10G LAN 5. Dual AMD EPYC驴 7002 Series Processors 6. 8TB Registered ECC DDR4 3200MHz SDRAM in 32 DIMMs 7. 4 PCI-E Gen 4 x16 (LP), 1 PCI-E Gen 4 x8 (LP) 8. 4 Hot-swap 2.5" drive bays (SAS/SATA/NVMe Hybrid) 9. 2x 2200W Titanium Level power supplies with Smart Power Redundancy 2x 3000W Titanium Level Redundant Power Supply option coming soon. Complete System Only: To maintain quality and integrity, this product is sold only as a completely-assembled system (with minimum 2 CPUs, Min of 1TB Memory for 80G HGX-4 A100 OR Min of 512GB Memory for 40G HGX-4 A100, 1 Storage device, and 1 NIC included in IO board). Service: OSNBD3 is highly recommended.
Super 2124GQ-NART,2xAMD7002/3,Up to 4GPUs,2x10GB,4xHS 2.5"(SAS3/SATA/NVMe),IPMI,D4(8TB),2U RM,R2200W
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Key Applications - AI Compute / Model Training / Deep Learning - High-performance Computing (HPC) Key Features 1. High Density 2U System with NVIDIA庐 HGX驴 A100 4-GPU 2. Supports 4 A100 40GB SXM4 GPUs 3. Direct connect PCI-E Gen4 Platform with NVIDIA庐 NVLink驴 4. On board BMC supports integrated IPMI 2.0 + KVM with dedicated 10G LAN 5. Dual AMD EPYC驴 7002 Series Processors 6. 8TB Registered ECC DDR4 3200MHz SDRAM in 32 DIMMs 7. 4 PCI-E Gen 4 x16 (LP), 1 PCI-E Gen 4 x8 (LP) 8. 4 Hot-swap 2.5" drive bays (SAS/SATA/NVMe Hybrid) 9. 2x 2200W Titanium Level power supplies with Smart Power Redundancy 2x 3000W Titanium Level Redundant Power Supply option coming soon.
Super 2124US-TNR,2x EPYC 7003,Video,NO LAN,24x HS 2.5" U.2 NVMe/SAS/SATA,IPMI,DDR4(8TB),2U RM,R1600W
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Key Features - Virtualization - Cloud Computing - High-End Enterprise Server - Hyperconverged Storage 1. Dual AMD EPYC驴 7003/7002 Series Processors (The latest AMD EPYC驴 7003 Series Processor with AMD 3D V-Cache驴 Technology requires BIOS version 2.3 or newer) 2. 8TB Registered ECC DDR4 3200MHz SDRAM in 32 DIMMs 3. Expansion slots: Must bundle with optional Ultra Riser Card  (see Optional Parts List) 1 PCI-E 4.0 x16 slot (FH, 9.5" L) [Details] 4. Integrated IPMI 2.0 + KVM with dedicated LAN 驴 Software Out of Band License  key (SFT-OOB-LIC) included  for OOB BIOS management 5. Flexible Ultra Riser/Network options 驴 see Optional Parts List 6. Drive Bays:  24 hot-swap 2.5" U.2 NVMe drive bays  Up to 24 SATA/SAS drive support via   optional SAS kit 7. 1600W Redundant Power Supplies Titanium Level (96%) (Full redundancy based on configuration and application load)