4741 - 4760 of 6078 Products
Super Talent NGFF DX3 240GB M.2 SATA3 Solid State Drive (TLC)
Super Talent NGFF DX3 240GB M.2 SATA3 Solid State Drive (TLC)
Starting at

麻豆原创 Sales

Mfr Part Number: FNX240MMRM Capacity: 240 GB Form Factor: NGFF (M.2) Interface: SATA3 NAND Flash: TLC Shock: 1500G (operating) Vibration: 16G (operating) Operating Temperature: -40掳C to 85掳C (I-temp), 0掳C to 70掳C Performance: Sequential Read Rate: up to 480 MB/s Sequential Write Rate: up to 400 MB/s Access Time: 0.2 ms Power Supply: 3.3V 卤 5% Thickness: 3.5 mm Dimensions: 22.0 x 80.0 x 3.5 mm

Super Talent NGFF DX3 480GB M.2 SATA3 Solid State Drive (TLC)
Super Talent NGFF DX3 480GB M.2 SATA3 Solid State Drive (TLC)
Starting at

麻豆原创 Sales

Mfr Part Number: FNX480MMRM Capacity: 480 GB Form Factor: NGFF (M.2) Interface: SATA3 NAND Flash: TLC Shock: 1500G (operating) Vibration: 16G (operating) Operating Temperature: -40掳C to 85掳C (I-temp), 0掳C to 70掳C Performance: Sequential Read Rate: up to 480 MB/s Sequential Write Rate: up to 400 MB/s Access Time: 0.2 ms Power Supply: 3.3V 卤 5% Thickness: 3.5 mm Dimensions: 22.0 x 80.0 x 3.5 mm

Super Talent NGFF ST2 16GB M.2 SATA3 Solid State Drive (MLC)
Super Talent NGFF ST2 16GB M.2 SATA3 Solid State Drive (MLC)
Starting at

麻豆原创 Sales

Mfr Part Number: FN4016MTRM(SZ) Capacity: 16 GB Form Factor: 42mm M.2 (42mm NGFF B Key) Interface: SATA3 NAND Flash: MLC Performance: Sequential Read Rate: 185 MB/s Sequential Write Rate: 25 MB/s Access Time: 0.2 ms Shock: 1500G (operating) Vibration: 16G (operating) Operating Temperature: -40 掳C to 85 掳C Reliability: MTBF: >1,000,000 hours Data Reliability: Built-in EDC/ECC function Wear Leveling: Dynamic and static Power Supply: 3.3V 卤 5% Thickness: 3.5 mm Dimensions: 22.0 x 42.0 x 3.5 mm

Super Talent NGFF ST2 32GB M.2 SATA3 Solid State Drive (MLC)
Super Talent NGFF ST2 32GB M.2 SATA3 Solid State Drive (MLC)
Starting at

麻豆原创 Sales

Mfr Part Number: FN4032MTRM(SZ) Capacity: 32 GB Form Factor: 42mm M.2 (42mm NGFF B Key) Interface: SATA3 NAND Flash: MLC Performance: Sequential Read Rate: 370 MB/s Sequential Write Rate: 50 MB/s Access Time: 0.2 ms Shock: 1500G (operating) Vibration: 16G (operating) Operating Temperature: -40 掳C to 85 掳C Reliability: MTBF: >1,000,000 hours Data Reliability: Built-in EDC/ECC function Wear Leveling: Dynamic and static Power Supply: 3.3V 卤 5% Thickness: 3.5 mm Dimensions: 22.0 x 42.0 x 3.5 mm

Super Talent NGFF ST2 64GB M.2 SATA3 Solid State Drive (MLC)
Super Talent NGFF ST2 64GB M.2 SATA3 Solid State Drive (MLC)
Starting at

麻豆原创 Sales

Mfr Part Number: FN4064MTRM Capacity: 64 GB Form Factor: 42mm M.2 (42mm NGFF B Key) Interface: SATA3 NAND Flash: MLC Performance: Sequential Read Rate: 484 MB/s Sequential Write Rate: 81 MB/s Access Time: 0.2 ms Shock: 1500G (operating) Vibration: 16G (operating) Operating Temperature: -40掳C to 85掳C (I-temp), 0掳C to 70掳 Reliability: MTBF: >1,000,000 hours Data Reliability: Built-in EDC/ECC function Wear Leveling: Dynamic and static Power Supply: 3.3V 卤 5% Thickness: 3.5 mm Dimensions: 42.0 x 22.0 x 3.5 mm

Super Talent NGFF ST3 32GB M.2 SATA3 Solid State Drive (MLC)
Super Talent NGFF ST3 32GB M.2 SATA3 Solid State Drive (MLC)
Starting at

麻豆原创 Sales

Mfr Part Number: FN4032MURM Capacity: 32 GB Form Factor: M.2 (42mm NGFF B Key) Interface: SATA3 NAND Flash: MLC Performance: Sequential Read Rate: 222 MB/s Sequential Write Rate: 38 MB/s Access Time: 0.2 ms Seek Time: 0 ms Shock: 1500G (operating) Vibration: 16G (operating) Operating Temperature: Commercial Grade: 0掳C to +70掳C Industrial Grade: -40 掳C to 85 掳C Reliability: MTBF: >1,000,000 hours Data Retention: JESD47 compliant Wear Leveling: Dynamic and static wear-leveling Power Supply: 3.3V 卤 5% Thickness: 3.5 mm Dimensions: 22.0 x 42.0 x 3.5 mm

Super X10DAC, 2x E5-2600v4/22C, 7.1 HD Audio, 2x GB/i210 LAN, TPM, 8x SAS3(LSI3008)+R, DDR4(2TB)
Super X10DAC, 2x E5-2600v4/22C, 7.1 HD Audio, 2x GB/i210 LAN, TPM, 8x SAS3(LSI3008)+R, DDR4(2TB)
Starting at

麻豆原创 Sales

Key Features 1. Dual socket R3 (LGA 2011) supports Intel庐 Xeon庐 processor E5-2600 v4/ v3 family; QPI up to 9.6GT/s 2. Intel庐 C612 chipset 3. Up to 2TB ECC 3DS LRDIMM , up to DDR4- 2400MHz ; 16x DIMM slots 4. 3 PCI-E 3.0 x16, 2 PCI-E 3.0 x8, and 1 PCI-E 2.0 x4 (in x8) slot 5. Dual GbE LAN ports via Intel庐 i210 6. 10x SATA3 (6Gbps) ports w/ Intel C612 controller; RAID 0, 1, 5, 10 7. 8x SAS3 (12Gbps) ports w/ LSI 3008 controller; SW RAID 0, 1, 10 8. 6x USB 3.0 (4 rear, 2 via header) 5x USB 2.0 (2 rear, 2 via header, 1 Type A) 9. 7.1 HD Audio with optical S/PDIF 10. Thunderbolt Add-On Card support

Super X10DAL-i, 2x E5-2600v4/22C, 7.1 HD Audio, 2x GB/i210 LAN, TPM, 10x SATA3(C612)+R, DDR4(1TB)
Super X10DAL-i, 2x E5-2600v4/22C, 7.1 HD Audio, 2x GB/i210 LAN, TPM, 10x SATA3(C612)+R, DDR4(1TB)
Starting at

麻豆原创 Sales

Key Features 1. Dual socket R3 (LGA 2011) supports Intel庐 Xeon庐 processor E5-2600 v4驴/ v3 family; QPI up to 9.6GT/s 2. Intel庐 C612 chipset 3. Up to 1TB驴 ECC 3DS LRDIMM , up to DDR4- 2400驴MHz ; 8x DIMM slots 4. 2x PCI-E 3.0 x16, 1x PCI-E 3.0 x8 (in x16), 1x PCI-E 3.0 x4 (in x8), 1x PCI-E 2.0 x4 (in x8) slot 5. Dual GbE LAN ports via Intel庐 i210 6. 10x SATA3 (6Gbps) ports w/ Intel C612 controller; RAID 0, 1, 5, 10 7. 6x USB 3.0 (4 rear, 2 via header) 3x USB 2.0 (2 via header, 1 Type A) 8. 7.1 HD Audio with optical S/PDIF 9. Thunderbolt Add-On Card support

Super X10DAX, 2x E5-2600v4/22C, 7.1 HD Audio, 2x GB/i210 LAN, TPM, 10x SATA3(C612)+R, DDR4(2TB)
Super X10DAX, 2x E5-2600v4/22C, 7.1 HD Audio, 2x GB/i210 LAN, TPM, 10x SATA3(C612)+R, DDR4(2TB)
Starting at

麻豆原创 Sales

Key Features Supports Hyper-Speed Supports 3-way Geforce SLI (4-way SLI support for dual GPU graphics cards) 1. Dual socket R3 (LGA 2011) supports Intel庐 Xeon庐 processor E5-2600 v4/ v3 family; QPI up to 9.6GT/s 2. Intel庐 C612 chipset 3. Up to 2TB ECC 3DS LRDIMM , up to DDR4- 2400MHz ; 16x DIMM slots 4. 3 PCI-E 3.0 x16, 2 PCI-E 3.0 x8, and 1 PCI-E 2.0 x4 (in x8) slot 5. Dual GbE LAN ports via Intel庐 i210 6. 10x SATA3 (6Gbps) ports w/ Intel C612 controller; RAID 0, 1, 5, 10 7. 6x USB 3.0 (4 rear, 2 via header) 5x USB 2.0 (2 rear, 2 via header, 1 Type A) 8. 7.1 HD Audio with optical S/PDIF 9. Thunderbolt Add-on-Card support

Super X10DAi, 2x E5-2600v4/22C, 7.1 HD Audio, 2x GB/i210 LAN, TPM, 10x SATA3(C612)+R, DDR4(2TB)
Super X10DAi, 2x E5-2600v4/22C, 7.1 HD Audio, 2x GB/i210 LAN, TPM, 10x SATA3(C612)+R, DDR4(2TB)
Starting at

麻豆原创 Sales

Key Features 1. Dual socket R3 (LGA 2011) supports Intel庐 Xeon庐 processor E5-2600 v4/ v3 family; QPI up to 9.6GT/s 2. Intel庐 C612 chipset 3. Up to 2TB ECC 3DS LRDIMM , up to DDR4- 2400MHz ; 16x DIMM slots 4. 3x PCI-E 3.0 x16, 2x PCI-E 3.0 x8, and 1x PCI-E 2.0 x4 (in x8) slot 5. Dual GbE LAN ports via Intel庐 i210 6. 10x SATA3 (6Gbps) ports w/ Intel C612 controller; RAID 0, 1, 5, 10 7. 6x USB 3.0 (4 rear, 2 via header) 5x USB 2.0 (2 rear, 2 via header, 1 Type A) 8. 7.1 HD Audio with optical S/PDIF 9. Thunderbolt Add-On Card support

Super X10DDW-i,2x E5-2600v4/22C,WIO/PCIe3(x24),Video,2x GB/i350 LAN,10x SATA3(C612)+R,IPMI,DDR4(2TB)
Super X10DDW-i,2x E5-2600v4/22C,WIO/PCIe3(x24),Video,2x GB/i350 LAN,10x SATA3(C612)+R,IPMI,DDR4(2TB)
Starting at

麻豆原创 Sales

Key Features 1. Dual socket R3 (LGA 2011) supports Intel庐 Xeon庐 processor E5-2600 v4/ v3 family; QPI up to 9.6GT/s 2. Intel庐 C612 chipset 3. Up to 2TB驴 ECC 3DS LRDIMM , up to DDR4- 2400MHz ; 16x DIMM slots 4. 1x PCI-E 3.0 x32 Left riser slot 1x PCI-E 3.0 x8 Right riser slot 1x PCI-E 3.0 x8 for Add-On-Module 5. Intel庐 i350 Dual port Gigabit Ethernet 6. 10x SATA3 (6Gbps); RAID 0, 1, 5, 10 7. Integrated IPMI 2.0 and KVM with Dedicated LAN 8. 3x USB 3.0 (2 rear, 1 Type A); 4x USB 2.0 (2 rear, 2 via header)

Super X10DRC-LN4+, 2x E5-2600v4/22C, Video, 4x GB/i350 LAN, 8x SAS3(LSI3108)+R, IPMI, DDR4(3TB)
Super X10DRC-LN4+, 2x E5-2600v4/22C, Video, 4x GB/i350 LAN, 8x SAS3(LSI3108)+R, IPMI, DDR4(3TB)
Starting at

麻豆原创 Sales

Key Features 1. Dual socket R3 (LGA 2011) supports Intel庐 Xeon庐 processor E5-2600 v4/ v3 family; QPI up to 9.6GT/s 2. Intel庐 C612 chipset 3. Up to 3TB\ ECC 3DS LRDIMM , up to DDR4- 2400MHz ; 24x DIMM slots 4. 2x PCI-E 3.0 x16, 3x PCI-E 3.0 x8, and 1x PCI-E 2.0 x4 (in x8) slot 5. Quad LAN w/ Intel庐 i350 GbE 6. 10x SATA3 (6Gbps) ports w/ Intel C612 controller; RAID 0, 1, 5, 10 7. 8x SAS3 (12Gbps) ports w/ LSI 3108 controller; RAID 0, 1, 5, 6, 10, 50, 60 SuperCap option support 8. Integrated IPMI 2.0 and KVM with Dedicated LAN 9. 5x USB 3.0 (2 rear, 2 internal, 1 Type A), 4x USB 2.0 ports (2 rear, 2 front panel)

Super X10DRC-T4+, 2x E5-2600v4/22C, Video, 4x 10GB/X540 LAN, 8x SAS3(LSI3108)+R, IPMI, DDR4(3TB)
Super X10DRC-T4+, 2x E5-2600v4/22C, Video, 4x 10GB/X540 LAN, 8x SAS3(LSI3108)+R, IPMI, DDR4(3TB)
Starting at

麻豆原创 Sales

Key Features 1. Dual socket R3 (LGA 2011) supports Intel庐 Xeon庐 processor E5-2600 v4/ v3 family; QPI up to 9.6GT/s 2. Intel庐 C612 chipset 3. Up to 3TB ECC 3DS LRDIMM , up to DDR4- 2400MHz ; 24x DIMM slots 4. 2x PCI-E 3.0 x16, 3x PCI-E 3.0 x8, and 1x PCI-E 2.0 x4 (in x8) slot 5. Quad LAN w/ Intel庐 X540 10GBase-T 6. 10x SATA3 (6Gbps) ports w/ Intel C612 controller; RAID 0, 1, 5, 10 7. 8x SAS3 (12Gbps) ports w/ LSI 3108 controller; RAID 0, 1, 5, 6, 10, 50, 60 SuperCap option support 8. Integrated IPMI 2.0 and KVM with Dedicated LAN 9. 5x USB 3.0 (2 rear, 2 front panel, 1 Type A), 4x USB 2.0 ports (2 rear, 2 front panel)

Super X10DRD-L, 2x E5-2600v4/22C, Video, 2x GB/i350 LAN, 6x SATA3(C612)+R, IPMI, DDR4(1TB)
Super X10DRD-L, 2x E5-2600v4/22C, Video, 2x GB/i350 LAN, 6x SATA3(C612)+R, IPMI, DDR4(1TB)
Starting at

麻豆原创 Sales

Key Features 1. Dual socket R3 (LGA 2011) supports Intel庐 Xeon庐 processor E5-2600 v4/ v3 family; QPI up to 9.6GT/s 2. Intel庐 C612 chipset 3. Up to 1TB ECC 3DS LRDIMM , up to DDR4- 2400MHz ; 8x DIMM slots 4. Expansion slot: 1x PCI-E 3.0 x8 5. Intel庐 i350 Dual port GbE LAN 6. 6x SATA3 (6Gbps) ports; RAID 0, 1, 5, 10 7. Integrated IPMI 2.0 and KVM with Dedicated LAN 8. 7x USB 2.0 ports (4 rear, 2 via headers, 1 Type A)

Super X10DRD-LT, 2x E5-2600v4/22C, Video, 2x 10GB/X540 LAN, 6x SATA3(C612)+R, IPMI, DDR4(1TB)
Super X10DRD-LT, 2x E5-2600v4/22C, Video, 2x 10GB/X540 LAN, 6x SATA3(C612)+R, IPMI, DDR4(1TB)
Starting at

麻豆原创 Sales

Key Features 1. Dual socket R3 (LGA 2011) supports Intel庐 Xeon庐 processor E5-2600 v4/ v3 family; QPI up to 9.6GT/s 2. Intel庐 C612 chipset 3. Up to 1TB ECC 3DS LRDIMM , up to DDR4- 2400MHz ; 8x DIMM slots 4. Expansion slot: 1x PCI-E 3.0 x8 5. Intel庐 X540 Dual port 10GBase-T 6. 6x SATA3 (6Gbps) ports; RAID 0, 1, 5, 10 7. Integrated IPMI 2.0 and KVM with Dedicated LAN 8. 7x USB 2.0 ports (4 rear, 2 via headers, 1 Type A)

Super X10DRD-LTP, 2x E5-2600v4/22C, Video, 2x 10GB/SFP+ LAN, 6x SATA3(C612)+R, IPMI, DDR4(1TB)
Super X10DRD-LTP, 2x E5-2600v4/22C, Video, 2x 10GB/SFP+ LAN, 6x SATA3(C612)+R, IPMI, DDR4(1TB)
Starting at

麻豆原创 Sales

Key Features 1. Dual socket R3 (LGA 2011) supports Intel庐 Xeon庐 processor E5-2600 v4/ v3 family; QPI up to 9.6GT/s 2. Intel庐 C612 chipset 3. Up to 1TB ECC 3DS LRDIMM , up to DDR4- 2400MHz ; 8x DIMM slots 4. Expansion slots: 1x PCI-E 3.0 x8 5. Intel庐 82599ES Dual port 10G SFP+ 6. 6x SATA3 (6Gbps) ports; RAID 0, 1, 5, 10 7. Integrated IPMI 2.0 and KVM with Dedicated LAN 8. 7x USB 2.0 ports (4 rear, 2 via headers, 1 Type A)

Super X10DRD-i, 2x E5-2600v4/22C, Video, 2x GB/i350 LAN, 10x SATA3(C612)+R, IPMI,DDR4(1TB)
Super X10DRD-i, 2x E5-2600v4/22C, Video, 2x GB/i350 LAN, 10x SATA3(C612)+R, IPMI,DDR4(1TB)
Starting at

麻豆原创 Sales

Key Features 1. Dual socket R3 (LGA 2011) supports Intel庐 Xeon庐 processor E5-2600 v4/ v3 family; QPI up to 9.6GT/s 2. Intel庐 C612 chipset 3. Up to 1TB ECC 3DS LRDIMM , up to DDR4- 2400MHz ; 8x DIMM slots 4. Expansion slots: 4x PCI-E 3.0 x8 5. Intel庐 i350 Dual port GbE LAN 6. 10x SATA3 (6Gbps) ports; RAID 0, 1, 5, 10 7. Integrated IPMI 2.0 and KVM with Dedicated LAN 8. 7x USB 2.0 ports (4 rear, 2 via headers, 1 Type A)

Super X10DRD-iNT, 2x E5-2600v4/22C, Video, 2x 10GB/X540 LAN, 10x SATA3(C612)+2x NVMe, IPMI,DDR4(1TB)
Super X10DRD-iNT, 2x E5-2600v4/22C, Video, 2x 10GB/X540 LAN, 10x SATA3(C612)+2x NVMe, IPMI,DDR4(1TB)
Starting at

麻豆原创 Sales

Key Features 1. Dual socket R3 (LGA 2011) supports Intel庐 Xeon庐 processor E5-2600 v4/ v3 family; QPI up to 9.6GT/s 2. Intel庐 C612 chipset 3. Up to 1TB ECC 3DS LRDIMM , up to DDR4- 2400MHz ; 8x DIMM slots 4. Expansion slots: 4x PCI-E 3.0 x8 5. Intel庐 X540 Dual port 10GBase-T 6. 10x SATA3 (6Gbps) ports; RAID 0, 1, 5, 10 7. Integrated IPMI 2.0 and KVM with Dedicated LAN 8. 7x USB 2.0 ports (4 rear, 2 via headers, 1 Type A) 9. 2x Internal NVMe ports (PCI-E 3.0 x4)

Super X10DRD-iT, 2x E5-2600v4/22C, Video, 2x 10GB/X540 LAN, 10x SATA3(C612)+R, IPMI,DDR4(1TB)
Super X10DRD-iT, 2x E5-2600v4/22C, Video, 2x 10GB/X540 LAN, 10x SATA3(C612)+R, IPMI,DDR4(1TB)
Starting at

麻豆原创 Sales

Key Features 1. Dual socket R3 (LGA 2011) supports Intel庐 Xeon庐 processor E5-2600 v4/ v3 family; QPI up to 9.6GT/s 2. Intel庐 C612 chipset 3. Up to 1TB ECC 3DS LRDIMM , up to DDR4- 2400MHz ; 8x DIMM slots 4. Expansion slots: 4x PCI-E 3.0 x8 5. Intel庐 X540 Dual port 10GBase-T 6. 10x SATA3 (6Gbps) ports; RAID 0, 1, 5, 10 7. Integrated IPMI 2.0 and KVM with Dedicated LAN 8. 7x USB 2.0 ports (4 rear, 2 via headers, 1 Type A)

Super X10DRD-iTP, 2x E5-2600v4/22C, Video, 2x 10GB/SFP+ LAN, 10x SATA3(C612)+R, IPMI, DDR4(1TB)
Super X10DRD-iTP, 2x E5-2600v4/22C, Video, 2x 10GB/SFP+ LAN, 10x SATA3(C612)+R, IPMI, DDR4(1TB)
Starting at

麻豆原创 Sales

Key Features 1. Dual socket R3 (LGA 2011) supports Intel庐 Xeon庐 processor E5-2600 v4/ v3 family; QPI up to 9.6GT/s 2. Intel庐 C612 chipset 3. Up to 1TB ECC 3DS LRDIMM , up to DDR4- 2400MHz ; 8x DIMM slots 4. Expansion slots: 4x PCI-E 3.0 x8 5. Intel庐 82599ES Dual port 10G SFP+ 6. 10x SATA3 (6Gbps) ports; RAID 0, 1, 5, 10 7. Integrated IPMI 2.0 and KVM with Dedicated LAN 8. 7x USB 2.0 ports (4 rear, 2 via headers, 1 Type A)